XCKU3P-L2FFVB676E
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- Mfr.Part #
- XCKU3P-L2FFVB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 34,907
- In Stock ：
- 34,907
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 0.698V ~ 0.876V
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Number of LABs/CLBs :
- 20340
- Mounting Type :
- Surface Mount
- Package / Case :
- 676-BBGA, FCBGA
- Total RAM Bits :
- 31641600
- Number of I/O :
- 280
- Supplier Device Package :
- 676-FCBGA (27x27)
- Number of Logic Elements/Cells :
- 355950
- Number of Gates :
- -
- Product Status :
- Active
- Datasheets
- XCKU3P-L2FFVB676E
FPGAs Kintex® UltraScale+™ Series 676-BBGA, FCBGA
XCKU3P-L2FFVB676E Overview
A 676-BBGA, FCBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 280 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 355950 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.698V~0.876V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Kintex® UltraScale+™ series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 31641600. Fpga electronics contains 20340 LABs/CLBs in an array.
XCKU3P-L2FFVB676E Features
280 I/Os
Up to 31641600 RAM bits
XCKU3P-L2FFVB676E Applications
There are a lot of Xilinx Inc.
XCKU3P-L2FFVB676E FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
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