XC3SD3400A-5FGG676C
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- Mfr.Part #
- XC3SD3400A-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FBGA
- Stock
- 38,055
- In Stock ：
- 38,055
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 2322432
- Mounting Type :
- Surface Mount
- Number of I/O :
- 469
- Package / Case :
- 676-BGA
- Number of LABs/CLBs :
- 5968
- Number of Logic Elements/Cells :
- 53712
- Number of Gates :
- 3400000
- Voltage - Supply :
- 1.14V ~ 1.26V
- Operating Temperature :
- 0°C ~ 85°C (TJ)
- Product Status :
- Active
- Supplier Device Package :
- 676-FBGA (27x27)
- Datasheets
- XC3SD3400A-5FGG676C
1.2V V FPGAs Spartan®-3A DSP Series 676-BGA
XC3SD3400A-5FGG676C Overview
A 676-BGA package is provided with this component. This device features 469 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 53712 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Spartan®-3A DSP series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 2322432. Related parts can be found by using its base part number XC3SD3400A. The FPGA module's RAM si283.5kBe reaches 283.5kB in order to ensure that the program operates in a normal manner. 676 pins are designed into the device. Fpga electronics contains 5968 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.2V-volt supply allows designers to fully utilize its flexibility. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. Operating temperatures should exceed 0°C. Among its basic building blocks, there are 3400000 gates that are included in it. 5968 logic blocks (LABs) make up its basic building blocks. 676-FBGA (27x27) stands for its supplier device package.
XC3SD3400A-5FGG676C Features
469 I/Os
Up to 2322432 RAM bits
676 LABs/CLBs
85°C gates
5968 logic blocks (LABs)
XC3SD3400A-5FGG676C Applications
There are a lot of Xilinx Inc.
XC3SD3400A-5FGG676C FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
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