MCF5470VR200

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Mfr.Part #
MCF5470VR200
Manufacturer
Freescale Semiconductor
Package / Case
388-BBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 388PBGA
Stock
8
In Stock :
8

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Manufacturer :
Freescale Semiconductor
Product Category :
Microcontrollers
Speed :
200MHz
RAM Size :
32K x 8
Program Memory Size :
-
Oscillator Type :
External
Supplier Device Package :
388-PBGA (27x27)
Package / Case :
388-BBGA
Number of I/O :
99
Operating Temperature :
0°C ~ 70°C (TA)
Data Converters :
-
EEPROM Size :
-
Voltage - Supply (Vcc/Vdd) :
1.43V ~ 1.58V
Peripherals :
DMA, PWM, WDT
Program Memory Type :
ROMless
Core Processor :
Coldfire V4E
Mounting Type :
Surface Mount
Product Status :
Active
Connectivity :
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Core Size :
32-Bit Single-Core
Datasheets
MCF5470VR200
VESS Electronics offers Microcontrollers Freescale Semiconductor MCF5470VR200, where excellence in quality meets cost-effectiveness. This premier offering shines with its comprehensive list of features, including Package / Case:388-BBGA, Operating Temperature:0°C ~ 70°C (TA), Mounting Type:Surface Mount, MCF5470VR200 pinout, MCF5470VR200 datasheet PDF, MCF5470VR200 amp .Beyond Microcontrollers Freescale Semiconductor MCF5470VR200 ,we also present a selection of PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our extensive stock is ready to fulfill your requirements. Connect with us now for tailored solutions.

ROMless Coldfire V4E 32-Bit Microcontroller MCF547x Series MCF5470 1.5V 388-BBGA

MCF5470VR200  Description

The STSPIN32F060x system-in-package is an extremely integrated solution for driving three-phase applications, helping designers to reduce PCB area and overall bill-of-material. It embeds an STM32F031x6x7 featuring an ARM? 32-bit Cortex?-M0 CPU and a600 V triple half-bridge gate driver, able to drive N-channel power MOSFETs rights.



MCF5470VR200  Features

Features list:

ColdFire V4e Core.

- Limited superscalar V4 ColdFire processor core

- Up to 266 MHz peak internal core frequency (410 MIPS

[Dhrystone 2.1] @ 266 MHz)

- Harvard architecture

-32-Kbyte instruction cache

- 32-Kbyte data cache

- Memory Management Unit (MMU)

-Separate, 32-entry, fully-associative instruction and

data translation lookahead buffers

- Floating point unit (FPU)

- Double-precision conforms to IEE-754 standard

- Eight floating point registers

Intemal master bus (XLB) arbiter

- High performance split address and data transactions

-Support for various parking modes

32-bit double data rate (DDR) synchronous DRAM

(SDRAM) controller

66-133 MHz operation

- Supports DDR and SDR DRAM

- Built-in initialization and refresh

- Up to four chip selets enabling up to one GB ofextermal

memory

Version 2. 2 peripheral component interconnect (PCI) bus

-32-bit target and initiator operation

- Support for up to five extemal PCI masters

- 33-66 MHz operation with PCI bus to XLB divider

ratiosof 1:1, 1:2, and 1:4

Flexible multi-function extermal bus (FlexBus)

-Provides a glueless interface to boot flash/ROM,

SRAM, and peripheral devices

- Up to six chip selects

- 33 - 66 MHz operation

Communications LO subsystem

- Intelligent 16 channel DMA controller

- Up to two 10/100 Mbps fast Ethernet controllers (FECs)

each with separate 2-Kbyte receive and transmit FIFOs

- Universal serial bus (USB) version 2.0 device controller

- Support for one control and six programmable



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